Transverse heterogeneity of bonding strength in Ti/steel clad plates fabricated by hot rolling with bimetal assembling
Yue Wu, Tao Wang, Tingting Zhang, Zhongkai Ren
Topics & Concepts
BimetalMaterials scienceTransverse planeWeldingEnhanced Data Rates for GSM EvolutionComposite materialBond strengthBonding strengthDrop (telecommunication)Stress (linguistics)MetallurgyMicrostructureCopperCrackingStructural engineeringLayer (electronics)AdhesivePhilosophyEngineeringTelecommunicationsLinguisticsComputer scienceAdvanced Welding Techniques AnalysisWelding Techniques and Residual StressesMetal Forming Simulation Techniques