Litcius/Paper detail

Cooling chip on PCB by embedded active microchannel heat sink

Yun-Hao Peng, Dai‐Hua Wang, Xinyu Li, Ying Zhang

2022International Journal of Heat and Mass Transfer39 citationsDOI

Topics & Concepts

CoolantHeat sinkMicrochannelMaterials scienceChipMechanical engineeringPrinted circuit boardComputer coolingHeat transferActive coolingHeat fluxThermal management of electronic devices and systemsNuclear engineeringWater coolingMechanicsElectrical engineeringEngineeringNanotechnologyPhysicsHeat Transfer and OptimizationHeat Transfer MechanismsHeat Transfer and Boiling Studies
Cooling chip on PCB by embedded active microchannel heat sink | Litcius