Hypo-eutectic microstructure formation and nanomechanical response in Sn-3.0Ag-0.5Cu solder balls: Effects of undercooling
B. Wang, Xiaojun Hu, W. Sun, Jiali Liao, H.L. Peng, Ning Hou, B. Chen, Guang Zeng
Topics & Concepts
Materials scienceMicrostructureEutectic systemNanoindentationSupercoolingCreepSolderingMetallurgyGrain sizeNucleationComposite materialDifferential scanning calorimetryVolume fractionThermodynamicsPhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesIntermetallics and Advanced Alloy Properties