Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration
Yiteng Wang, Atom O. Watanabe, Nobuo Ogura, P. Markondeya Raj, Rao Tummala
Topics & Concepts
Materials scienceSinteringInterconnectionCopperElectrical conductorElectronic engineeringElectronic packagingOptoelectronicsComposite materialMetallurgyComputer scienceEngineeringTelecommunicationsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties