Effect of gamma irradiation on microstructural evolution and mechanical properties of SnPb eutectic solder joints
Qilong Guan, Chunjin Hang, Shengli Li, Xiaojiu Tang, Gang Yao, Dan Yu, Ying Ding, Xiu‐Li Wang, Wei Zhang
Abstract
Eutectic SnPb ball grid array (BGA) solder joints were exposed to 60Co source gamma irradiation at a dose rate of 1 Gy(Si)/s from 0, 50, 100, 150 and 200 h in air. The effects of gamma irradiation on the microstructure evolution and mechanical properties of the solder joints were investigated. After irradiation, β-Sn and Pb on the surface of the solder joint was oxidized to SnO2, PbO and PbO2, and an oxide layer covered with Cu oxide was formed on the surface of the solder joint. The formation process and mechanism of the oxide layer were analyzed. Sn and Pb depletion holes and Cu depletion areas appeared on the solder joint surfaces after various irradiation time. SnO2 nanocrystals and Sn wrinkles appeared in the FIB specimen after irradiation. After 200 h of irradiation, the melting temperature of the SnPb eutectic solder alloy decrease, and the shear force value of the solder joint first increase and then decrease.