Properties of ultrathin molybdenum films for interconnect applications
Valeria Founta, Jean-Philippe Soulié, Kiroubanand Sankaran, Kris Vanstreels, Karl Opsomer, P. Morin, Pieter Lagrain, Alexis Franquet, Danielle Vanhaeren, Thierry Conard, Johan Meersschaut, Christophe Detavernier, Joris Van de Vondel, Ingrid De Wolf, Geoffrey Pourtois, Zsolt Tökei, Johan Swerts, Christoph Adelmann
Topics & Concepts
Materials scienceAnnealing (glass)Electrical resistivity and conductivityOverlayerThin filmComposite materialDielectricCrystallinityGrain boundaryMolybdenumChemical vapor depositionSilicideMetallurgyNanotechnologyOptoelectronicsMicrostructureCondensed matter physicsLayer (electronics)EngineeringElectrical engineeringPhysicsCopper Interconnects and ReliabilityMetal and Thin Film MechanicsSemiconductor materials and devices