Stress-driven triple junction reconstruction facilitates cooperative grain boundary deformation
Yingbin Chen, Qi Zhu, Jian Han, Tianlin Huang, Ze Zhang, Jiangwei Wang
Topics & Concepts
Materials scienceTriple junctionGrain boundaryDeformation (meteorology)Stress (linguistics)Composite materialGrain boundary strengtheningMetallurgyMicrostructureOptoelectronicsPhilosophyLinguisticsMicrostructure and mechanical propertiesMechanical stress and fatigue analysisHigh Temperature Alloys and Creep