Fatigue crack evolution and effect analysis of Ag sintering die-attachment in SiC power devices under power cycling based on phase-field simulation
Yutai Su, Guicui Fu, Changqing Liu, Canyu Liu, Xu Long
Topics & Concepts
Materials scienceSinteringDie (integrated circuit)InterconnectionTemperature cyclingComposite materialStress (linguistics)Power modulePhase (matter)Power (physics)ThermalStructural engineeringComputer scienceEngineeringNanotechnologyPhysicsPhilosophyLinguisticsQuantum mechanicsOrganic chemistryChemistryComputer networkMeteorologyAluminum Alloys Composites PropertiesAluminum Alloy Microstructure PropertiesMetallurgy and Material Forming