Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review
Xi Wang, Liang Zhang, Mulan Li
Topics & Concepts
Materials scienceSolderingIntermetallicMicrostructureElectronic packagingElectronicsMelting temperatureCreepMetallurgyComposite materialAlloyPhysical chemistryChemistryElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesIntermetallics and Advanced Alloy Properties