Enhanced tensile ductility of tungsten microwires via high-density dislocations and reduced grain boundaries
Chaoqun Dang, Weitong Lin, Fanling Meng, Hongti Zhang, Sufeng Fan, Xiaocui Li, Ke Cao, Haokun Yang, Wenzhao Zhou, Zhengjie Fan, Ji‐Jung Kai, Yang Lü
Topics & Concepts
Materials scienceTungstenGrain boundaryDuctility (Earth science)Electron backscatter diffractionUltimate tensile strengthComposite materialElongationDislocationBrittlenessGrain boundary strengtheningMetallurgyMicrostructureCreepMicrostructure and mechanical propertiesMetal and Thin Film MechanicsAdvanced materials and composites