Molding compounds based on aminophenoxyphthalonitrile/epoxy resin for high-temperature electronic packaging applications
Jiateng Huang, Feiyu Zhu, Wei Hu, Qiunan Xie, Xiaohan Li, Xiaoma Fei, Jingcheng Liu, Xiaojie Li, Wei Wei
Topics & Concepts
EpoxyMolding (decorative)Materials scienceElectronic packagingComposite materialHigh heatElectronic materialsNanotechnologySynthesis and properties of polymersEpoxy Resin Curing ProcessesPolymer crystallization and properties