Interfacial void ripening in Cu Cu joints
Hung-Che Liu, Andriy Gusak, K. N. Tu, Chih Chen
Topics & Concepts
Materials scienceVoid (composites)Ostwald ripeningAnnealing (glass)Transmission electron microscopyComposite materialRipeningKinetic energyCrystallographyNanotechnologyPhysicsFood scienceChemistryQuantum mechanics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies