Litcius/Paper detail

Crystal plasticity finite element simulation of TSV microstructure under thermal and vibration loading

Guifang Chen, Xin You, Yeting Xu, Hongjiang Qian, Peng Wang

2025Microelectronics Journal5 citationsDOI

Topics & Concepts

Finite element methodCrystal plasticityMicrostructureMaterials scienceVibrationPlasticityStructural engineeringThermalComposite materialMechanical engineeringEngineeringAcousticsPhysicsThermodynamicsAdvanced Surface Polishing TechniquesMetal and Thin Film Mechanics3D IC and TSV technologies