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A Compact Sixth-Order Common-Mode Noise Suppression Filter Based on 3-D Integration Technology

Fengjuan Wang, Cangcang Hou, Xiangkun Yin, Ningmei Yu, Yuan Yang

2023IEEE Transactions on Components Packaging and Manufacturing Technology11 citationsDOI

Abstract

Based on three-dimensional (3-D) integration technology, a compact sixth-order common-mode noise suppression filter is proposed according to delay line theory. As the important parts of the filter, the on-chip inductors are established by through-silicon vias (TSVs), and the capacitors are realized by double layer interdigital structure. Compared with other relative literatures, the proposed filter has a minimized size of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$0.29\times0.32$ </tex-math></inline-formula> mm (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$0.0203\times 0.0224\,\,\lambda _{g}^{2}$ </tex-math></inline-formula>). And it can suppress the common-mode noise more than 10 dB from 3.8 to 8.6 GHz or more than 20 dB from 4.45 to 7.85 GHz. Meanwhile, the differential signal insertion loss is kept less than 3 dB.

Topics & Concepts

CapacitorFilter (signal processing)Noise (video)MathematicsInsertion lossLambdaNotationTopology (electrical circuits)AlgorithmElectronic engineeringElectrical engineeringComputer sciencePhysicsEngineeringCombinatoricsArithmeticOpticsArtificial intelligenceImage (mathematics)VoltageElectromagnetic Compatibility and Noise Suppression3D IC and TSV technologiesRadio Frequency Integrated Circuit Design