Leveraging the Cu<sub>2</sub>SnTe<sub>3</sub> additive for an improved thermoelectric figure of merit and module efficiency in Bi<sub>0.5</sub>Sb<sub>1.5</sub>Te<sub>3</sub>-based composites
Qiaoyan Pan, Kaikai Pang, Qiang Zhang, Yan Liu, Huilie Shi, Jingsong Li, Wenjie Zhou, Qianqian Sun, Yuyou Zhang, Xiaojian Tan, Peng Sun, Jiehua Wu, Guoqiang Liu, Jun Jiang
Abstract
The highly active additive Cu 2 SnTe 3 generates multi-scale defects, effectively reducing lattice thermal conductivity. Along with optimized weighted mobility, the higher quality factor yields a competitive ZT value in the (Bi,Sb) 2 Te 3 -based composite.
Topics & Concepts
Figure of meritThermoelectric effectThermal conductivityMaterials scienceElectrical resistivity and conductivityLattice (music)Quality (philosophy)Thermoelectric materialsEngineering physicsCondensed matter physicsOptoelectronicsElectrical engineeringPhysicsThermodynamicsComposite materialEngineeringAcousticsQuantum mechanicsAdvanced Thermoelectric Materials and DevicesThermal properties of materialsThermal Radiation and Cooling Technologies