A novel antioxidant and low-temperature Sn-Zn solder paste based on Zn@Sn core-shell structure
Fengyi WANG, Xinjie WANG, Ziwen Lv, Chunjin Hang, Hongtao Chen, Mingyu LI
Topics & Concepts
Materials scienceSolderingIntermetallicMetallurgyShear strength (soil)MicrostructureComposite materialZincBrittlenessMelting pointLayer (electronics)Core (optical fiber)Soil waterEnvironmental scienceAlloySoil scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis