Litcius/Paper detail

Enhanced Thermal Conductivity and Tensile Strength of Copper Matrix Composite with Few-Layer Graphene Nanoplates

Fei Jia, Kun Wei, Wei Wei, Fu Qiang Chu, Qing Bo Du, Igor Alexandrov, Jing Hu

2021Journal of Materials Engineering and Performance14 citationsDOI

Topics & Concepts

Materials scienceThermal conductivityComposite materialGrapheneUltimate tensile strengthInterfacial thermal resistanceCopperMicrostructureComposite numberPhonon scatteringThermal resistanceThermalMetallurgyNanotechnologyMeteorologyPhysicsAluminum Alloys Composites PropertiesGraphene research and applicationsThermal properties of materials