Synthesis of highly antioxidant and low-temperature sintering Cu-Ag core–shell submicro-particles for high-power density electronic packaging
Wanchun Yang, Wei Zheng, Shaowei Hu, Mingyu Li
Topics & Concepts
Materials scienceSinteringChemical engineeringDispersion (optics)NanostructureFormic acidNanoparticleMetallurgyNanotechnologyOrganic chemistryChemistryEngineeringOpticsPhysicsNanomaterials and Printing TechnologiesElectronic Packaging and Soldering TechnologiesInjection Molding Process and Properties