Double-layered core–shell heterostructures of mSiO2@CdS@CeO2 abrasive systems toward photochemical mechanical polishing (PCMP) applications
Menghan Wang, Zhaoyu Mu, Tianyu Wang, Yang Chen, Ailian Chen
Topics & Concepts
PolishingMaterials scienceWaferHeterojunctionAbrasiveChemical-mechanical planarizationMesoporous materialLayer (electronics)Mesoporous silicaChemical engineeringOptoelectronicsComposite materialNanotechnologyChemistryCatalysisBiochemistryEngineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchElectronic and Structural Properties of Oxides