Facile dynamic current deposition of high tensile gradient Cu foil with (110) preferred orientation
Wei Liu, Geng Li, Yuankun Wang, Zhimeng Hao, Yufeng Zhang, Zhenhua Yan, Qing Zhao, Jun Chen
Topics & Concepts
Materials scienceFOIL methodUltimate tensile strengthComposite materialToughnessDeposition (geology)FabricationElectrodeCurrent densityElectrical conductorConductivityMetallurgyAlternative medicineChemistryPathologyPhysicsBiologySedimentPhysical chemistryPaleontologyMedicineQuantum mechanicsElectrodeposition and Electroless CoatingsCopper Interconnects and ReliabilitySemiconductor materials and interfaces