Mechanical Performance of Copper‐Nanocluster‐Polymer Nanolattices
Jin Tang, Heyi Liang, An Ren, Liang Ma, Hao Wei, Yuqing Yao, Letian Zheng, Hanying Li, Qi Li
Abstract
Abstract A type of copper‐nanocluster‐polymer composites is reported and showcased that their 3D nanolattices exhibit a superior combination of high strength, toughness, deformability, resilience, and damage‐tolerance. Notably, the strength and toughness of ultralight copper‐nanocluster‐polymer nanolattices in some cases surpass current best performers, including alumina, nickel, and other ceramic or metallic lattices at low densities. Additionally, copper‐nanocluster‐polymer nanolattices are super‐resilient, crack‐resistant, and one‐step printed under ambient condition which can be easily integrated into sophisticated microsystems as highly effective internal protectors. The findings suggest that, unlike traditional nanocomposites, the laser‐induced interface and the high fraction of ultrasmall Cu 15 nanoclusters as crosslinking junctions contribute to the marked nonlinear elasticity of copper‐nanocluster‐polymer network, which synergizes with the lattice‐topology effect and culminates in the exceptional mechanical performance.