Electrodeposition, microstructure and characterization of high-strength, low-roughness copper foils with polyethylene glycol additives
Jian Huang, Ning Song, Mingwei Chen, Yun‐Zhi Tang, Xiao‐Wei Fan
Abstract
PEG. The characterization results showed that the copper foil possesses a high (220) crystal plane orientation and low twin layer thickness. Further analysis suggested that twin boundaries strengthened by stacking faults were the main reason for the high tensile strength of copper foils. Electrochemical behavioral studies indicated that PEG increased the cathodic polarization and improved the nucleation rate, thereby refining the copper foil grain size. The high (220) crystal plane orientation and high density of twin grain boundaries caused by the stacking faults strengthened the copper foil more than the fine-grain strengthening. This work offers theoretical guidance for modulating the properties of copper foil using PEG.