The microstructure evolution and failure mechanism of Sn37Pb solder joints under the coupling effects of extreme temperature variation and electromigration
Shengli Li, Chunjin Hang, Qilong Guan, Xiaojiu Tang, Dan Yu, Ying Ding, Xiuli Wang
Topics & Concepts
Materials scienceElectromigrationMicrostructureSolderingFailure mechanismComposite materialCoupling (piping)Variation (astronomy)Mechanism (biology)MetallurgyEpistemologyPhilosophyPhysicsAstrophysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis