Effect of Ni2+ concentration on microstructure and bonding capacity of electroless copper plating on carbon fibers
Qiwen Zhou, Guanglong Li, Zhenping Zhou, Yingdong Qu, Ruirun Chen, Xuefeng Gao, Wendong Xu, Sainan Nie, Chang Tian, Rongde Li
Topics & Concepts
Sodium hypophosphiteCoatingCopperHypophosphiteMaterials scienceMicrostructurePlating (geology)Composite materialCopper platingChemical engineeringMetallurgyParticle sizeFormaldehydeComposite numberChemistryLayer (electronics)Organic chemistryEngineeringGeologyElectroplatingGeophysicsElectrodeposition and Electroless CoatingsAluminum Alloys Composites PropertiesElectromagnetic wave absorption materials