Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock

Ruyu Tian, Yanhong Tian, Yilong Huang, Dongsheng Yang, Cheng Chen, Huhao Sun

2021Journal of Materials Science Materials in Electronics30 citationsDOI

Topics & Concepts

SolderingMaterials scienceThermal shockMetallurgyIntermetallicLayer (electronics)Shear strength (soil)Surface finishComposite materialAlloySoil waterSoil scienceEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties