The influence of cracks in the coupling region of micro-grinding and laser stealth combined dicing on the quality of cutting side walls
Jie Li, Fu Liu, Wei Zhou, Yi Zhang
Topics & Concepts
Wafer dicingMaterials scienceComposite materialGrindingWaferSurface roughnessGrain sizeCoupling (piping)NanotechnologyAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisLaser Material Processing Techniques