Polyimide resins with superior thermal stability, dielectric properties, and solubility obtained by introducing trifluoromethyl and diphenylpyridine with different bulk pendant groups
Shuanger Li, Haoran Zhu, Feng Bao, Xiaoqian Lan, Hong Li, Yadong Li, Muwei Ji, Mingliang Wang, Caizhen Zhu, Jian Xu, Jian Xu
Topics & Concepts
PolyimideDielectricMaterials scienceGlass transitionTrifluoromethylThermal stabilitySolubilityDielectric lossThermal decompositionPolymer chemistryComposite materialChemical engineeringOrganic chemistryChemistryPolymerLayer (electronics)AlkylEngineeringOptoelectronicsSynthesis and properties of polymersSilicone and Siloxane ChemistryEpoxy Resin Curing Processes