Fabrication of PS-DVB@Cu core-shell microsphere for anisotropic conductive adhesives by electroless plating with copper nanoparticles as seeds
Yuling Shi, Qing Liu, Qianqian Pan, Danlong Yang, Tao Wang
Topics & Concepts
Materials scienceCopperNanoparticleCopper platingPlating (geology)Electrical resistivity and conductivityFabricationElectrical conductorChemical engineeringComposite materialLayer (electronics)NanotechnologyMetallurgyElectroplatingGeologyEngineeringAlternative medicineElectrical engineeringPathologyMedicineGeophysicsElectronic Packaging and Soldering TechnologiesNanomaterials and Printing TechnologiesSynthesis and properties of polymers