Highly efficient chemical mechanical polishing method for SiC substrates using enhanced slurry containing bubbles of ozone gas
Michio Uneda, Koji Fujii
Topics & Concepts
SlurryX-ray photoelectron spectroscopyChemical-mechanical planarizationOzoneMaterials scienceOxidizing agentSilicon carbidePolishingSubstrate (aquarium)Chemical engineeringComposite materialChemistryOrganic chemistryEngineeringOceanographyGeologyAdvanced Surface Polishing TechniquesAdvanced ceramic materials synthesisAdvanced Machining and Optimization Techniques