Investigation of the chemical action mechanism based on reactive force field in SiC chemical–mechanical polishing process
Yuqi Zhou, Yuhua Huang, Jinming Li, Weishan Lv, Fulong Zhu
Topics & Concepts
ReaxFFPolishingAdhesiveChemical-mechanical planarizationChemisorptionMaterials scienceDiamondChemical engineeringAdhesive wearComposite materialChemistryMolecular dynamicsAbrasiveAdsorptionPhysical chemistryComputational chemistryLayer (electronics)Interatomic potentialEngineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdvanced materials and composites