Brittle–ductile transition model for ultrasonic vibration–assisted blade dicing
Hanwei Teng, Shuo Chen, Rendi Kurniawan, Shujian Li, Changping Li, Moran Xu, Jielin Chen, Tae Jo Ko
Topics & Concepts
Wafer dicingMaterials scienceBlade (archaeology)BrittlenessVibrationStructural engineeringUltrasonic sensorComposite materialEngineeringAcousticsPhysicsLayer (electronics)Advanced Surface Polishing TechniquesAdvanced machining processes and optimizationForce Microscopy Techniques and Applications