Interface evolution and strengthening of two-step roll bonded copper/aluminum clad composites
Wenjing Wang, Hao Wang, Xue-feng Liu, Zhicheng Liu
Topics & Concepts
Materials scienceIntermetallicScanning electron microscopeComposite materialCopperExtrusionComposite numberElectron backscatter diffractionAluminiumAccumulative roll bondingDeformation (meteorology)Transmission electron microscopyMetallurgyMicrostructureAlloyNanotechnologyAluminum Alloys Composites PropertiesMicrostructure and mechanical propertiesAdvanced Welding Techniques Analysis