Recent advances in mechanism, influencing parameters, and dopants of electrospun <scp>EMI</scp> shielding composites: A review
Xiuhong Li, Kai Li, Shuailong Zhang, Jinjiao Zhang, Xinyu Hu, Yi Li, Yong Liu
Abstract
Abstract The rapid development and popularization of smart and portable electronic devices have led to increasingly related electromagnetic pollution affecting human health and equipment safety. Thus, designing high‐performance electromagnetic interference (EMI) shielding materials with lightweight, flexible, and easy preparation is urgent. The intrinsic physiochemical properties of electrospun micro/nanofibers provide an attractive potential to ease and accelerate the next‐generation EMI shielding materials. Here, a detailed review of the electrospun EMI shielding materials is established. First, this article outlines the shielding mechanism of EMI shielding materials obtained via electrospinning. Then, the affecting factors of electrospinning process conditions on the resulting EMI shielding micro/nanofibers are discussed. Next, diverse fillers that contribute to the EMI shielding efficiency of electrospun materials are demonstrated. Finally, the conclusion and prospects are introduced, hopefully contributing to assisting with more comprehensive and rational designs of high‐performance electrospun fiber‐based EMI shielding for various applications. Priority measures and future directions are suggested for the future development of electrospun EMI shielding materials.