Effects of anisotropy on the reliability of TSV microstructure
Zhengwei Fan, Xun Chen, Yao Liu, Yu Jiang, Yunan Zhang
Topics & Concepts
Materials scienceReliability (semiconductor)IsotropyThrough-silicon viaSiliconCopperSubstrate (aquarium)AnisotropyStress (linguistics)MicrostructureInterconnectionTemperature cyclingComposite materialOptoelectronicsThermalEngineering physicsMetallurgyComputer scienceOpticsEngineeringLinguisticsComputer networkQuantum mechanicsOceanographyPhilosophyGeologyMeteorologyPower (physics)Physics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdvanced Surface Polishing Techniques