Five-membered heterocyclic small molecule compounds as novel levelling agents for blind-hole copper plating
Tao Zhang, Chaojie Zheng, Haidi Li, Shiqi Song, Wei Huang, Qiaoxia Li, Yulin Min, Xixun Shen, Qunjie Xu
Topics & Concepts
CopperChemistryCyclic voltammetryCopper platingLinear sweep voltammetryElectroplatingElectrochemistryPlating (geology)ElectrodeChemical engineeringOrganic chemistryPhysical chemistryGeologyLayer (electronics)GeophysicsEngineeringElectrodeposition and Electroless CoatingsCopper Interconnects and ReliabilityCorrosion Behavior and Inhibition