Effect of cure shrinkage of epoxy molding compound on warpage behavior of semiconductor package
Jeong-Hyeon Baek, Dong-Woon Park, Gyung-Hwan Oh, Dong-Ok Kawk, Simon S. Park, Hak‐Sung Kim
Topics & Concepts
Materials scienceEpoxyShrinkageComposite materialCuring (chemistry)ViscoelasticityFiber Bragg gratingMolding (decorative)WavelengthOptoelectronicsElectronic Packaging and Soldering TechnologiesNanofabrication and Lithography TechniquesEpoxy Resin Curing Processes