Interface healing mechanism of fine-grained Ni–Co‐based superalloy during hot‐compression bonding
Shaofei Ren, Xiaolong Bai, Sheng Liu, Mingyue Sun, Bin Xu, Chuanyong Cui
Topics & Concepts
Materials scienceDynamic recrystallizationNucleationSuperalloyGrain boundaryRecrystallization (geology)SubstructureComposite materialMetallurgyMicrostructureHot workingThermodynamicsStructural engineeringBiologyPhysicsPaleontologyEngineeringHigh Temperature Alloys and CreepMetallurgy and Material FormingMetal Alloys Wear and Properties