Experimental study on ultra-thin silicon-based VC for chip-level heat dissipation
Dongfang Zhou, Chenghao Li, Wei Wang, Gongming Xin
Topics & Concepts
Materials scienceMiniaturizationThermal resistanceOverheating (electricity)Thermal management of electronic devices and systemsHeat transferHeat fluxThermalHeat sinkOptoelectronicsChipIntegrated circuitThermal conductivityComposite materialMechanical engineeringNanotechnologyElectrical engineeringMechanicsThermodynamicsEngineeringPhysicsHeat Transfer and Boiling StudiesHeat Transfer and OptimizationThermal properties of materials