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Corrosion behavior of Sn-based lead-free solder alloys: a review

Shuai Li, Xingxing Wang, Zhongying Liu, Yongtao Jiu, Shuye Zhang, Jinfeng Geng, Xiaoming Chen, WU Shengjin, Peng He, Weimin Long

2020Journal of Materials Science Materials in Electronics105 citationsDOI

Topics & Concepts

Materials scienceSolderingCorrosionMetallurgyLead (geology)MicrostructureAlloyGeomorphologyGeologyElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAdvanced Welding Techniques Analysis
Corrosion behavior of Sn-based lead-free solder alloys: a review | Litcius