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Enhancement of thermal conductivity and mechanical properties of silicone rubber with oriented fillers connected by covalent bonds

Liang Zhang, Jianhui Qiu, Eiichi Sakai, Huixia Feng, Hong Wu, Hiroyuki Yamaguchi, Yasunori Chonan, Mitsuyoshi Nomura

2025Composites Part A Applied Science and Manufacturing13 citationsDOI

Topics & Concepts

Materials scienceComposite materialSilicone rubberCovalent bondThermal conductivitySiliconeNatural rubberFiller (materials)ThermalOrganic chemistryChemistryMeteorologyPhysicsThermal properties of materialsPolymer Nanocomposite Synthesis and IrradiationSynthesis and properties of polymers
Enhancement of thermal conductivity and mechanical properties of silicone rubber with oriented fillers connected by covalent bonds | Litcius