Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less
Chuantong Chen, Zheng Zhang, Qian Wang, Bowen Zhang, Yue Gao, Tetsuya Sasamura, Yukinori Oda, Ninshu Ma, Katsuaki Suganuma
Topics & Concepts
Materials scienceElectron backscatter diffractionScanning electron microscopeMetallurgySinteringPlating (geology)Shear strength (soil)Grain sizeComposite materialMicrostructureSoil scienceGeologySoil waterEnvironmental scienceGeophysicsSilicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties