Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering
Wanli Li, Yitian Li, Yujian Wang, Yuncan Liu, Chuantong Chen, Jie Zhang, Haidong Yan
Topics & Concepts
Materials scienceWettingSurface tensionComposite materialSinteringShear strength (soil)SolventFlakeShear (geology)Contact angleElectrical resistivity and conductivityOrganic chemistryChemistrySoil waterElectrical engineeringSoil scienceQuantum mechanicsEnvironmental scienceEngineeringPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesNanomaterials and Printing Technologies