Polymer-Compatible Low-Temperature Plasma-Enhanced Chemical Vapor Deposition of Graphene on Electroplated Cu for Flexible Hybrid Electronics
Chen‐Hsuan Lu, Chyi‐Ming Leu, N.-C. Yeh
Abstract
ratio can sustain many more bending cycles. Additionally, graphene coverage is shown to suppress the formation of copper oxides in ambient environment for at least 8 weeks after the PECVD process.
Topics & Concepts
GrapheneMaterials sciencePlasma-enhanced chemical vapor depositionElectroplatingChemical vapor depositionPassivationPolymerFlexible electronicsCopperGraphene foamNanotechnologyChemical engineeringComposite materialGraphene nanoribbonsMetallurgyLayer (electronics)EngineeringGraphene research and applicationsSupercapacitor Materials and FabricationZnO doping and properties