Effects of grain orientation and grain size on etching behaviors of high-strength and high-conductivity Cu alloy
Jinyang Fang, Chaofeng Li, Feng Liu, Huilin Hou, Xin-Li Zhang, Qingke Zhang, Lijing Yang, Cheng Xu, Zhenlun Song, Zhenlun Song
Topics & Concepts
Materials scienceEtching (microfabrication)Grain sizeAlloyMicrostructureSurface roughnessMetallurgyGrain boundarySurface finishIsotropic etchingComposite materialLayer (electronics)Microstructure and mechanical propertiesAluminum Alloy Microstructure PropertiesAdvanced Surface Polishing Techniques