Recent advances in CeO<sub>2</sub> based abrasives for chemical mechanical polishing
Yongxin Wang, Yunhui Shi, Jiabao Cheng, Yao Xu, Yizhan Wang, Jiawei Qiu
Abstract
Chemical mechanical polishing (CMP) is a technique that combines chemical etching and mechanical grinding to achieve atomic-level surface planarization in various materials, playing a key role in wafer thinning.
Topics & Concepts
Chemical-mechanical planarizationPolishingWaferMaterials scienceGrindingEtching (microfabrication)Isotropic etchingNanotechnologyMetallurgyLayer (electronics)Advanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchIntegrated Circuits and Semiconductor Failure Analysis