Strengthening epoxy adhesives at elevated temperatures based on dynamic disulfide bonds
Hsing-Ying Tsai, Yasuyuki Nakamura, T. Fujita, Masanobu Naito
Abstract
Epoxy resins incorporating aromatic disulfide bonds demonstrated improved adhesive properties with increasing temperature below their glass transition points.
Topics & Concepts
EpoxyAdhesiveDisulfide bondGlass transitionMaterials scienceComposite materialBondPolymer chemistryChemistryPolymerLayer (electronics)BusinessFinanceBiochemistryPolymer composites and self-healingPhotopolymerization techniques and applicationsSynthesis and properties of polymers