Temperature-dependent inhibition of PEG in acid copper plating: Theoretical analysis and experiment evidence
Zhiqiang Lai, Chong Wang, Yunzhong Huang, Yuanming Chen, Shouxu Wang, Yan Hong, Guoyun Zhou, Wei He, Xinhong Su, Yukai Sun, Yingguo Tao, Xiaoyan Lu
Topics & Concepts
PEG ratioMaterials scienceCopperPolyethylene glycolDensity functional theoryCopper platingAdsorptionElectrochemistryPlating (geology)Chemical engineeringInorganic chemistryPhysical chemistryMetallurgyComposite materialComputational chemistryLayer (electronics)ChemistryElectrodeFinanceElectroplatingEngineeringEconomicsGeophysicsGeologyCorrosion Behavior and InhibitionElectrodeposition and Electroless CoatingsCopper Interconnects and Reliability