Characterization analysis of 355 nm pulsed laser cutting of 6H-SiC
Shih‐Feng Tseng, Cheng-Xing Luo, Wen-Tse Hsiao
Topics & Concepts
Materials scienceLaserWaferGroove (engineering)Silicon carbideDiamondScanning electron microscopePulse repetition frequencyX-ray photoelectron spectroscopySiliconOpticsOptoelectronicsAnalytical Chemistry (journal)Composite materialMetallurgyChemistryRadarComputer scienceNuclear magnetic resonanceTelecommunicationsPhysicsChromatographyDiamond and Carbon-based Materials ResearchAdvanced Surface Polishing TechniquesLaser Material Processing Techniques