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Ultrasonic-assisted soldering of SiCp/Al metal matrix composites using Sn–Ag–Cu–Al solder at low temperatures

Guojing Xu, Xinran Ma, Wenkang Du, Pu Zhao, Yuanhang Xia, Zhengwei Li, Zhiwu Xu, Jiuchun Yan

2025Composites Part A Applied Science and Manufacturing6 citationsDOI

Topics & Concepts

Materials scienceSolderingComposite materialMetalUltrasonic sensorMatrix (chemical analysis)MetallurgyAcousticsPhysicsAluminum Alloys Composites PropertiesAdvanced Welding Techniques AnalysisElectronic Packaging and Soldering Technologies
Ultrasonic-assisted soldering of SiCp/Al metal matrix composites using Sn–Ag–Cu–Al solder at low temperatures | Litcius