Improved indium bumps bonding process using flexible composite structure temporary substrate for micro-LED display applications
Xiaowei Huang, Taifu Lang, Xuehuang Tang, Yujie Xie, Xin Lin, Yifan Yang, Shuaishuai Wang, Xiongtu Zhou, Yongai Zhang, Jie Sun, Chang Lin, Qun Yan, Qun Yan
Topics & Concepts
Materials scienceComposite numberSubstrate (aquarium)IndiumOptoelectronicsProcess (computing)Composite materialNanotechnologyComputer scienceOceanographyGeologyOperating system3D IC and TSV technologiesAdvanced Sensor and Energy Harvesting MaterialsNanomaterials and Printing Technologies